Monday, December 2, 2013

Heat issues with Intel’s upcoming high-capacity SSDs prompted design adjustments



Upcoming Fultondale and Pleasantdale SSDs required adjustments by designers because of increased power consumption and thermal signature.





Intel is pushing past 500GB, all the way to 800 and 1600 GB with its upcoming high capacity SSDs and had to make some design adjustments after initial testing.

According to documents seen by VR-Zone, the thermal profile and power consumption of Fultondale and Pleasantdale required Intel to make the bottom surface of the drive ribbed in order to better dissipate heat.



Reportedly, under maximum workload these drives will require 25 W of power.

Inside the drives will be two boards, one of which will be populated entirely by NAND while the other will have NAND and the memory controller.

These two SSDs are expected out in the fourth quarter of 2014, likely at IDF.





Read More: http://vr-zone.com/articles/heat-iss...nts/65636.html






via VRForums | Singapore Technology Lifestyle Forums - News around the web! http://forums.vr-zone.com/showthread.php?t=2976867&goto=newpost

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